Hardware Engineer

As an innovative spin-off from the Hong Kong University of Science and Technology (HKUST),  we are dedicated to pioneering the futureof robotics .

We specialize in developing high-precision tactile sensors that grant robots a genuine sense of "touch ."  This capability is set to advance intelligent robotics technology to new heights .

Our vision is supported by significant backing, including tens of millions of HKD in R&D funding from the Hong Kong SAR Government and investment from top-tier venture capital firms .

我们是一家源自香港科技大学的前沿科技公司，专注于为机器人研发高精度触觉传感器，赋予机器人真实的"触觉"能力。这项技术突破将推动智能机器人技术迈向新高度。该愿景获得了香港特区政府数千万港元研发资金及顶级风险投资机构的鼎力支持。

Responsibilities & Requirements

1. Hardware System Design

(1) Participate actively in the full product

development lifecycle ;

(2) Design circuit schematics and develop

substrate/PCB layouts ;

(3) Optimize sensor power supply and energy consumption ;

(4) Collaborate with PCB/substrate/FPC

suppliers,conducting Design for Manufacturability (DFM) reviews. Perform signal integrity (SI) and power integrity (PI) simulations and implement optimizations .

1. 硬件系统设计

(1) 深度参与完整产品开发周期；

(2) 设计电路原理图并开发基板/PCB布局；

(3) 优化传感器供电与能耗管理；

(4) 协同PCB/基板/FPC供应商进行可制造性设计评审（DFM），执行信号完整性（SI）与电源完整性（PI）仿真，并根据结果实施优化。

2. Embedded Software Develop

(1) Responsible for setting up the product's embedded environment and driver development ;

(2) Participate in analyzing and designing embedded technology solutions ;

(3) Responsible for identifying and resolving embedded issues during product development and writing technical documentation .
2. 嵌入式软件开发

(1) 负责搭建产品嵌入式环境及驱动开发；

(2) 参与嵌入式技术方案分析与设计；

(3) 负责产品开发过程中的嵌入式问题定位与解决，编写技术文档。

3. Validation And Testing

(1) Build hardware test platforms for evaluating new electronic devices and components for potential use in future products ;

(2) Conduct simulations and physical testing to validate the design, including circuit analysis, electromagnetic analysis, EMC/EMI requirments/regulations ;

(3) Stay up-to-date with the latest trends and developments in electronic design and apply them to the design process .

3. 验证与测试

(1) 搭建硬件测试平台，评估新型电子器件在未来产品中的应用潜力；

(2) 通过仿真与物理测试验证设计（含电路分析、电磁分析、EMC/EMI合规性验证）；

(3) 追踪电子设计前沿技术并应用于开发流程。

Qualification

1.Bachelor’s degree or higher in Telecommunications, Electronics, CS, Automation, EM/Microwave Engineering, or related fields ;

2.Proficient in at least one EDA ;

3.Have ability to design and develop schematic and 4-layer PCB independently ;

4.Experienced with at least one mainstream MCU(STM32, ESP32, etc.) ;

5.Experience with C/C++ programming ;

6.Knowledge of safety compliance (EMC, etc.) with rich debugging/troubleshooting experience ;

7.Familiar with common communication protocols (UART/I2C/SPI, etc.) ;

8.Skilled in hardware test equipment (oscilloscopes, multimeters, etc.) ;

9.Proficient in sensor signal conditioning circuits (amplification/filtering/isolation) ;

10.Proficient in written and spoken Mandarin and English ;

11.Must hold or be able to obtain full working rights in Hong Kong before onboarding.

Location: Nanshan District, Shenzhen;

12.Priority given to:

- Participants of Robocon/RoboMaster robotics competitions ;

- Candidates with full product lifecycle experience ;

- Those with robotics industry exposure .

1. 通信工程、电子工程、计算机、自动化、电磁与微波技术等相关专业本科及以上学历，2年以上相关工作经验；

2. 精通至少一种EDA工具；

3. 具备独立设计原理图及4层PCB的开发能力；

4. 熟悉至少一款主流MCU（如STM32/ESP32等）；

5. 具有C/C++编程经验；

6. 掌握安规标准（如EMC等），具备丰富调试/问题排查经验；

7. 熟悉常用通信协议（UART/I2C/SPI等）；

8. 熟练操作硬件测试设备（示波器、万用表等）；

9. 精通传感器信号调试电路设计（放大/滤波/隔离）；

10. 具备中英文书面及口语沟通能力；

11. 须持有或能在入职前获取在香港合法工作的权利，工作地点在深圳市南山；

12. 优先考虑：

● 参加过Robocon/RoboMaster等机器人大赛者；

● 具有完整产品开发流程经验者；

● 具备机器人行业经验者。

请有意者投递至邮箱：hr@agiletact.com或直接点击“快速申请”